Advanced Packaging Engineer

4 days ago

Ottawa, Ontario, Canada RANOVUS Full time
Job Title: Advanced Packaging Engineer

RANOVUS is a leading provider of next-generation data center infrastructure solutions. We are seeking an experienced Advanced Packaging Engineer to join our team in Ottawa, Canada.

Job Summary:

We are looking for a highly skilled engineer to work on the development of advanced packaging solutions for photonic components. The successful candidate will be responsible for designing and developing complex sub-assemblies, components, and packaging as assigned. They will also participate in new product development programs, assess material and tooling selection, and work with manufacturing to troubleshoot problems.

Key Responsibilities:
  • Design and develop complex sub-assemblies, components, and packaging as assigned.
  • Develop and implement changes to product design and/or the manufacturing process to achieve efficiency, quality, and/or cost improvements.
  • Develop requirement specifications, system concepts, CAD generated using SolidWorks, detail drawings, BOM's and budgets.
  • Provide customer product design engineering for economic production.
  • Assess proper material, tooling, automation and equipment selection.
  • Work with manufacturing to trouble-shoot problems, upgrades, retrofits, set-ups, methods development, and the development of process parameters.
  • Participate in product development meetings and make recommendations to product design changes to enhance manufacturing and assembly.
  • Conduct proof of concept experiments and design other testing requirements as needed.
  • Develop SOP's operations and maintenance manuals.
  • Research new technology or development tools to remain informed of current technology.
  • Understanding of Lean Six Sigma tools, projects and processes and ability to incorporate these into assigned engineering projects.
Requirements:
  • Experience with Photonic, Laser, and ASIC components and micro-assembly.
  • Experience in flip chip, chip on chip die attachment (on wafer), fiber attachment processes.
  • 5-10 years of solid experience in related work.
  • Excellent ability to solve technical, scientific and experimental problems.
  • Excellent teamwork and communication skills.
Education:

Master's or PhD preferred in a related engineering discipline.

RANOVUS is an equal opportunity employer and employs personnel without regard to age, ancestry, colour, race, citizenship, ethnic origin, place of origin, creed, disability, family status, marital status (including single status), gender identity, gender expression, record of offences, sex, or sexual orientation.

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