Die Ejection Systems Engineer for CoW/CoWoS

Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...

TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: 8 Admiralty Stree Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience) Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...

Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients....

A leading engineering advisory firm in Alberta is seeking a TCB Design Engineer with expertise in die ejection systems for semiconductor packaging. You will lead design efforts requiring knowledge of mechanical stress analysis and sophisticated CAD tools. Ideal candidates should have over 5 years of experience in semiconductor equipment design, demonstrating...

A leading HR consultancy in Canada seeks a Mechanical Design Engineer specializing in die ejection systems for semiconductor packaging equipment. The ideal candidate will have 5+ years of experience and a strong background in mechanical stress analysis and precision tooling design. You will lead the design of innovative ejection modules while collaborating...

About PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our...

Semiconductor Packaging Module Design Engineer (TCB / Die Handling) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...

TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced...

Position Title TCB (Thermo Compression Bonding) Design Engineer Location Admiralty Street Working Days 5 Day A Week Working Hours 9:00am - 6:00pm Salary $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...

About CoW DAO CoW DAO is on a mission to protect Ethereum users from the dangers of DeFi. It does this by supporting the development of CoW Protocol, CoW Swap, MEV Blocker, and CoW AMM, and by funding values-aligned projects through the CoW Grants Program. CoW Protocol is the second-largest DEX aggregator by monthly volume and the first-largest intents-based...