TCB Design Engineer( Die Ejection
2 weeks ago
Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered. TAN LEE XIAN Reg No: R The Supreme HR Advisory Pte Ltd EA No: 14C7279 Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands‑on experience in ejecting ultra‑thin dies (down to 25 µm) from wafers and familiarity with Chip‑on‑Wafer (CoW) package handling for CoWoS assembly. This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage. Key Responsibilities Lead the design of die ejection modules capable of handling ultra‑thin dies (≤ 25 µm). Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection. Incorporate simulation‑based validation (FEA) for warpage, stress, and deformation analysis. Design ejection solutions that effectively mitigate residue‑related yield loss from wafer dicing tape. Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick‑up. Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput. Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications. Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection. Analyze yield loss due to ejection‑related defects and implement design or process improvements. Support cross‑functional teams in root‑cause analysis and failure prevention. Requirements Bachelor’s or Master’s degree in Mechanical Engineering, Mechatronics, or related field. 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems. Strong background in mechanical stress analysis, warpage modeling, and precision tooling design. Proficiency with SolidWorks, Creo, or equivalent 3D CAD software. Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis. Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages. Prior involvement in CoWoS, 2.5D, or HBM packaging processes. Hands‑on experience with tape residue management, die pick‑up optimization, or die attach automation. Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques. Experience collaborating with process, electrical, and software teams in semiconductor tool development. #J-18808-Ljbffr
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TCB Design Engineer – Die Ejection Systems
1 week ago
, AB, Canada The Supreme HR Advisory Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...
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Design Engineer
1 week ago
, AB, Canada The Supreme HR Advisory Full timeTCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: 8 Admiralty Stree Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience) Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...
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Die Ejection Engineer for Ultra-Thin 25µm Dies
3 weeks ago
, AB, Canada The Supreme HR Advisory Full timeA leading engineering advisory firm in Alberta is seeking a TCB Design Engineer with expertise in die ejection systems for semiconductor packaging. You will lead design efforts requiring knowledge of mechanical stress analysis and sophisticated CAD tools. Ideal candidates should have over 5 years of experience in semiconductor equipment design, demonstrating...
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, AB, Canada The Supreme HR Advisory Full timeSemiconductor Packaging Module Design Engineer (TCB / Die Handling) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
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TCB Design Engineer
3 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition Title TCB (Thermo Compression Bonding) Design Engineer Location Admiralty Street Working Days 5 Day A Week Working Hours 9:00am - 6:00pm Salary $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
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Senior Die Ejection Engineer — CoWoS Packaging
3 weeks ago
, AB, Canada The Supreme HR Advisory Full timeA leading HR consultancy in Canada seeks a Mechanical Design Engineer specializing in die ejection systems for semiconductor packaging equipment. The ideal candidate will have 5+ years of experience and a strong background in mechanical stress analysis and precision tooling design. You will lead the design of innovative ejection modules while collaborating...
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Die Ejection Systems Engineer for CoW/CoWoS
3 weeks ago
, AB, Canada The Supreme HR Advisory Full timeA recruitment agency specialized in engineering positions is seeking a Mechanical Design Engineer to lead the design of die ejection systems for semiconductor packaging. The role requires expertise in mechanical stress analysis and precision tooling design, with a focus on ultra-thin dies and CoWoS packages. Candidates should have at least 5 years of...
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TCB Design Engineer
4 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition title: TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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TCB Semiconductor Packaging Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timeTCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced...
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TCB Semiconductor Packaging Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
