Head of Process Engineering – Thermo-Compression Bonder Systems
3 weeks ago
About PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our technical leadership team to accelerate the Alpha build of our HBM-class TCB platform targeted for 2026. Position Overview The Head of Process Engineering will lead the definition, development, and qualification of next-generation TCB bonding processes and their translation into capability requirements. The role requires deep hands-on experience in flux-less thermal compression bonding, formic-acid/N₂ environments, and precision die-to-substrate assembly at fine (< 50 µm). This position reports directly to the CEO and will collaborate closely with the Head of Equipment Engineering and software control teams. Key Responsibilities Lead process development for flux-less Thermo-Compression Bonding (TCB) for advanced packaging (HBM, CoWoS, 2.5D/3D). Define critical-to-quality (CTQ) parameters and Design Validation Plan & Report (DVP&R) frameworks for bonding yield, die tilt, and warpage control. Establish and maintain formic-acid bonding environment and N₂ tunnel process standards. Correlate process responses with equipment parameters (Z-axis control, force-temperature loops, heater uniformity, clamping pressure). Develop and own process FMEA, SPC, and predictive maintenance metrics. Interface with customers and partners (e.g. Micron Singapore, regional OSATs) for process qualification and yield improvement. Coach and build a local team of process and integration engineers; drive knowledge transfer and documentation. Collaborate with mechanical, control, and software groups to ensure process requirements are translated into tool specifications. Contribute to patent generation and technical papers on bonding process innovation. Requirements Essential Qualifications Bachelor’s or Master’s Degree in Mechanical, Materials, Mechatronics, or Semiconductor Process Engineering. 8+ years in advanced semiconductor packaging or wafer-level bonding process development. Demonstrated expertise in Thermo-Compression Bonding (TCB) or Hybrid Bonding (Cu-Cu / micro-bump ≤ 50 µm pitch). Strong understanding of thermal-mechanical interaction, formic-acid environment, and yield optimization. Experience leading cross-site process alignment, FMEA, and equipment qualification. Excellent analytical, documentation, and communication skills in English. Preferred / Advantages Experience with Intel / TSMC / ASMPT / Hanmi TCB tools or similar. Knowledge of AI-based predictive control, vibration isolation, or signal maintenance systems. Proven record of mentoring engineers and managing technology transfer projects. #J-18808-Ljbffr
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TCB Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition title : TCB Design Engineer (Thermo Compression Bonding) Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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Head of Thermo-Compression Bonding
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, AB, Canada Pyxis CF Full timeA leading semiconductor packaging company in Alberta is seeking a Head of Process Engineering to lead the development of next-generation bonding processes in semiconductor packaging. This role requires extensive experience in Thermo-Compression Bonding and a strong educational background in relevant engineering fields. Candidates must possess over 8 years of...
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TCB Semiconductor Packaging Design Engineer
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TCB Design Engineer
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, AB, Canada The Supreme HR Advisory Full timePosition Title TCB (Thermo Compression Bonding) Design Engineer Location Admiralty Street Working Days 5 Day A Week Working Hours 9:00am - 6:00pm Salary $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
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TCB Design Engineer
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, AB, Canada The Supreme HR Advisory Full timePosition title: TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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TCB Semiconductor Packaging Design Engineer
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, AB, Canada The Supreme HR Advisory Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
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TCB Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen...
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, AB, Canada The Supreme HR Advisory Full timeA premier HR advisory firm in Canada, Alberta is searching for a Laser-Assisted Bonder (LAB) Process Engineer. You will develop and optimize laser bonding processes for chip packaging, ensuring high precision and reliability. The ideal candidate should possess a relevant degree and has 2-5 years of experience in semiconductor packaging processes. This...
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TCB Design Engineer
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, AB, Canada The Supreme HR Advisory Full timeTCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role Overview The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal...
