Head of Thermo-Compression Bonding

About PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our...

Position title : TCB Design Engineer (Thermo Compression Bonding) Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...

TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems - EH03 Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role Overview The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during...

A leading HR advisory firm in Alberta seeks a TCB Design Engineer to optimize mechanical designs for Thermo-Compression Bonding equipment used in semiconductor packaging. Candidates should possess a degree in Engineering, 2-5 years of experience in precision equipment design, and strong CAD tool proficiency. The role requires teamwork and hands-on experience...

TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: 8 Admiralty Stree Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience) Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...

TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced...

Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...

Position Title TCB (Thermo Compression Bonding) Design Engineer Location Admiralty Street Working Days 5 Day A Week Working Hours 9:00am - 6:00pm Salary $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...

Overview We are seeking an engineer to join our advanced semiconductor packaging team. The candidate should specialize in thermo-mechanical simulation and analysis for advanced package architectures, with a focus on warpage prediction of large packages and thermal behaviour during Thermocompression (TC) bonding. This role will involve close collaboration...

Senior Engineer - Thermo-Mechanical Simulation (Semiconductor Packaging) Location: Admiralty Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $4000 - $8000 (depends experience) Overview We are seeking an engineer to join our advanced semiconductor packaging team. The candidate should specialize in thermo-mechanical simulation and analysis...