TCB Design Engineer
2 weeks ago
Position title : TCB Design Engineer (Thermo Compression Bonding) Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput. Key Responsibilities Mechanical Design and Development Design and develop mechanical modules for Thermocompression Bonders used in chip-to-wafer and chip-to-substrate bonding applications. Create and maintain detailed 3D and 2D CAD models, perform tolerance stack-up analyses, and prepare complete BOMs. Design precision subsystems such as bond heads, bond stages, thin/large die handling modules, plasma cleaning units, N₂ purge systems, and cleanroom Class 100 assemblies. Evaluate material and component selections for thermal, mechanical, and vacuum performance. Project Planning and Execution Define project scope, deliverables, and timelines for assigned modules. Support planning, scheduling, and cost estimation for mechanical subassemblies. Work closely with electrical, software, and vision teams for system-level integration. Participate in prototype build, machine debug, and verification activities. Provide on-site engineering support during system installation, customer buy-off, and troubleshooting. Process and Technology Integration Collaborate with process engineering to optimize mechanical designs for bonding quality, alignment accuracy, and thermal uniformity. Contribute to improvements in temperature control, pressure regulation, and force calibration within the bonding process. Support technology transfer from R&D to production, including documentation and training. Apply statistical process control (SPC) and inline monitoring techniques to ensure repeatability and yield consistency. Compliance and Safety Ensure designs meet internal standards for mechanical safety, cleanroom compatibility, and ergonomic considerations. Adhere to environmental, health, and safety (EHS) policies during design, assembly, and testing activities. Participate in design reviews and risk assessments to verify design robustness and maintainability. Requirements Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field. 2–5 years of direct experience in precision equipment design, preferably for semiconductor packaging, die attach, or advanced interconnect processes. Strong knowledge of Thermocompression Bonding (TCB), Laser-Assisted Bonding, or related assembly technologies. Proficiency in 3D CAD tools (e.g., SolidWorks, Creo, NX) and mechanical simulation tools for stress, thermal, or modal analysis. Familiarity with bonding and inspection tools such as X-ray, SAM, and optical microscopy. Understanding of materials behavior under thermal/mechanical stress, including CTE mismatch, adhesive curing, and flux management. Ability to work in cross-disciplinary teams and support parallel development programs under tight schedules. Hands‑on experience with HBM, CoWoS, 2.5D packaging, or fluxless bonding is a strong advantage. Interested Personal kindly contact WhatsApp : (Lydia) OR Email to : The Supreme HR Advisory Pte Ltd Reg No: R EA No: 14C7279 #J-18808-Ljbffr
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, AB, Canada The Supreme HR Advisory Full timeA semiconductor equipment company is seeking a TCB Design Engineer to design, develop, and optimize TCB modules for semiconductor packaging. The ideal candidate has a background in Mechanical or Electrical Engineering, with 2-5 years of relevant experience. Responsibilities include prototype fabrication and collaboration with engineering teams. A salary...
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TCB Packaging Design Engineer: Die Handling
3 weeks ago
, AB, Canada The Supreme HR Advisory Full timeA leading HR consulting firm in Alberta seeks a TCB (Thermo Compression Bonding) Design Engineer. This role involves designing and optimizing TCB modules for semiconductor packaging, collaborating with various engineering teams to ensure efficiency and quality. Ideal candidates will possess a degree in an engineering field and have 2-5 years of relevant...
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Semiconductor Packaging Module Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timeSemiconductor Packaging Module Design Engineer (TCB / Die Handling) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
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TCB Packaging Module Designer: Chip‑to‑Wafer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timeA leading HR consultancy firm in Canada is looking for a Semiconductor Packaging Module Design Engineer to design, develop, and optimize TCB modules for advanced semiconductor packaging. The ideal candidate holds a relevant degree and has 2–5 years of experience in the field, particularly with TCB technologies. Responsibilities include collaborating with...
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TCB Design Engineer – Precision Bonding Systems
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timeA leading HR advisory firm in Alberta seeks a TCB Design Engineer to optimize mechanical designs for Thermo-Compression Bonding equipment used in semiconductor packaging. Candidates should possess a degree in Engineering, 2-5 years of experience in precision equipment design, and strong CAD tool proficiency. The role requires teamwork and hands-on experience...
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TCB Design Engineer
4 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition Title TCB (Thermo Compression Bonding) Design Engineer Location Admiralty Street Working Days 5 Day A Week Working Hours 9:00am - 6:00pm Salary $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
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TCB Design Engineer
3 weeks ago
, AB, Canada The Supreme HR Advisory Full timeA leading HR advisory firm in Canada is seeking a TCB Design Engineer for designing systems controlling oxygen levels during thermal processes. The candidate will collaborate cross-functionally and handle cleanroom design. Minimum 5 years of experience in precision equipment design and proficiency in relevant CAD tools are required. The position offers a...
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TCB Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen...
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TCB Semiconductor Packaging Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timeTCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced...
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TCB Semiconductor Packaging Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
