Microelectronic Packaging Design Engineer
12 hours ago
At Sanmina, we are seeking a highly skilled Microelectronic Packaging Design Engineer to join our team. As a key member of our Global Design Engineering Team, you will be responsible for designing and developing microelectronic packaging solutions for our customers.
Job PurposeThe Microelectronic Design Engineering team represents one of the key strategic growth areas of our total engineering service offering. Our team provides engineering and design services in microelectronic, optical, and semiconductor packaging and component design, supported through our in-depth background in materials technology, thermal, structural, and reliability engineering.
Nature of Duties/Responsibilities:- Selection and definition of microelectronic technologies and design concepts, based on product applications, requirements, and specifications.
- Design of microelectronic modules, component, and packages, including substrate layout and detailed designs integrating elements of material selections, mechanical, and thermal design, as well as incorporating key aspects of reliability, electrical (RF), optical, test, and process engineering for volume manufacturing.
- Contribute to microelectronic design and engineering activities as part of a multidisciplinary product development team, including electrical/RF engineering, optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering, and test engineering, in line with customer requirements and specifications.
- Generate product documentation, including design specifications, drawings (piece parts, assembly, process), Bill of Materials, documentation release by engineering change order (ECO).
- Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components.
- Perform and support engineering product verification, ensuring compliance to product requirements.
- Support business development initiatives, including interfacing with potential and existing customers, preparation of marketing materials, proposals, and quotations.
- Support turnkey product development process through to manufacturing implementation.
- Bachelor's Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging, including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications.
- Minimum of 5 years' of relevant experience.
- Experience in Wafer Level Packaging (WLP) and Chip Scale Packaging (CSP).
- Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
- Experience in end-to-end product development and manufacturing implementation.
- Proficient in computer-aided design software and tools (AutoCad, SolidWorks).
- Familiar with packaging and substrate design software (Cadence Allegro Package Designer Plus).
- Familiar with commercial FEA software and tools in support of thermal, structural, and fatigue (solder joint reliability) analysis.
- Security clearance is an asset.
- Customer-focused with strong communication skills, and has the ability to work within a multidisciplinary product development team in a fast-paced and challenging environment.
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