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Microelectronic Packaging Design Engineer
2 months ago
About Sanmina's Advanced Microsystems Technologies (AMT)
Sanmina's AMT division is a leading provider of RF, Microelectronic, Optical components and Integrated Subsystems. We offer comprehensive services from design concept through prototype development, process innovation, assembly, and volume manufacturing. Our expertise spans diverse industries, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices, and test & measurement systems.
Job Purpose
The Microelectronic Design Engineering team is a key strategic growth area within Sanmina's Global Design Engineering Team. We specialize in microelectronic, optical, and semiconductor packaging and component design, leveraging our deep understanding of materials technology, thermal, structural, and reliability engineering.
We are seeking a talented Microelectronic Packaging Design Engineer to join our team and contribute to both technology and product development programs. Your role will encompass the entire product lifecycle, from initial technology selection and concept definition through detailed design, prototyping, qualification, and volume manufacturing phases.
Responsibilities:- Select and define microelectronic technologies and design concepts based on product applications, requirements, and specifications.
- Design microelectronic modules, components, and packages, including substrate layout and detailed designs. Integrate elements of material selections, mechanical and thermal design, reliability, electrical (RF), optical, test, and process engineering for volume manufacturing.
- Collaborate with a multidisciplinary product development team, including electrical/RF engineers, optical engineers, reliability engineers, layout specialists, documentation, manufacturing/process engineers, and test engineers. Ensure alignment with customer requirements and specifications.
- Generate product documentation, including design specifications, drawings (piece parts, assembly, process), Bill of Materials, and engineering change orders (ECOs).
- Define specifications/requirements and coordinate with manufacturers/suppliers for outsourced custom components.
- Perform and support engineering product verification to ensure compliance with product requirements.
- Support business development initiatives by interfacing with potential and existing customers, preparing marketing materials, proposals, and quotations.
- Contribute to the turnkey product development process through to manufacturing implementation.
- Bachelor's Degree in Mechanical Engineering, Physics, or a related field with experience in electronic hardware design and packaging, including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications.
- Minimum of 5 years of relevant experience.
- Experience in Wafer Level Packaging (WLP) and Chip Scale Packaging (CSP).
- Background or relevant experience in microelectronic technologies, materials, components, and manufacturing methods.
- Experience in end-to-end product development and manufacturing implementation.
- Proficiency in computer-aided design software and tools (AutoCAD, SolidWorks).
- Strong analytical and problem-solving skills.
