Microelectronic Packaging Design Specialist

1 week ago

Canada Sanmina Full time

Job Title: Microelectronic Packaging Design Engineer

Job Summary:

Sanmina is seeking a highly skilled Microelectronic Packaging Design Engineer to join our team. As a key member of our Global Design Engineering Team, you will be responsible for designing and developing microelectronic modules, components, and packages for various applications.

Key Responsibilities:

  • Design and select microelectronic technologies and design concepts based on product applications, requirements, and specifications.
  • Develop detailed designs integrating elements of material selections, mechanical and thermal design, and reliability, electrical (RF), optical, test, and process engineering for volume manufacturing.
  • Contribute to microelectronic design and engineering activities as part of a multidisciplinary product development team.
  • Generate product documentation, including design specifications, drawings, Bill of Materials, and documentation release by engineering change order (ECO).
  • Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components.
  • Perform and support engineering product verification, ensuring compliance to product requirements.
  • Support business development initiatives, including interfacing with potential and existing customers, preparation of marketing materials, proposals, and quotations.

Requirements:

  • Bachelor's Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging.
  • Minimum of 5 years' of relevant experience.
  • Experience in Wafer Level Packaging (WLP) and Chip Scale Packaging (CSP).
  • Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
  • Experience in end-to-end product development and manufacturing implementation.
  • Proficient in computer-aided design software and tools (AutoCad, SolidWorks).
  • Familiar with packaging and substrate design software (Cadence Allegro Package Designer Plus).
  • Familiar with commercial FEA software and tools in support of thermal, structural, and fatigue (solder joint reliability) analysis.
  • Customer-focused with strong communication skills and ability to work within a multidisciplinary product development team in a fast-paced and challenging environment.

Sanmina is an equal opportunities employer and welcomes applications from persons with disabilities.

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