Senior High-Speed IC Package Development Engineer

4 weeks ago


Ottawa, Ontario, Canada Marvell Technology Full time

Job Title: Senior High-Speed IC Package Development Engineer

Job Summary:

Marvell Technology is seeking a highly skilled Senior High-Speed IC Package Development Engineer to join our Central Engineering team. As a key member of our packaging organization, you will be responsible for developing advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond.

Key Responsibilities:

  • Develop and characterize high-speed IC packages for digital and analog ICs.
  • Design and model package electrical and thermal performance.
  • Interface with package suppliers to select package technology and ensure manufacturability.
  • Collaborate with marketing and IC designers to develop achievable package specs.
  • Contribute to new package technology development and drive layout to meet performance, reliability, and cost requirements.

Requirements:

  • Bachelor's degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master's/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience.
  • Strong fundamentals in EM, transmission lines and microwave theory.
  • Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity.
  • Ability to manage package development involving various cross-functional teams.
  • Familiarity with IC package layout tools like APD or PADS.
  • Experience with 2.5D/3D package development is highly desired.
  • Ability to automate SI, PI and Packaging activities using scripting tools like Python.
  • Working knowledge of circuit design tools: Spectre, ADS, HSpice.
  • Experience with VNA and TDR measurements for package and PCB characterization.
  • Frequency domain and time domain knowledge of high-speed signaling.
  • Experience with high-speed electronic packaging for digital and analog ICs.
  • Power plane design, modeling and analysis using tools like PowerSI, SIwave.
  • Familiarity with packaging technologies, materials, package substrate design rules and assembly rules.
  • Understanding, debugging and simulations of EMI/EMC problems.
  • Track record of new product introduction from concept, through development and production is a plus.
  • Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
  • Experience with channel simulations using MATLAB or ADS or other tools is a plus.
  • A team player.
  • Strong communication, presentation, and documentation skills.

What We Offer:

With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We're dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us.

Equal Employment Opportunity:

Marvell Technology is an equal employment opportunity employer and welcomes applications from diverse candidates. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.



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