Principal Engineer

18 hours ago


Burnaby, British Columbia, Canada Microchip Technology Full time
Job Title: Principal Engineer - Advanced Packaging Solutions

We are seeking a highly skilled Principal Engineer - Advanced Packaging Solutions to join our team at Microchip Technology. As a key member of our packaging design team, you will be responsible for designing and developing advanced packaging solutions for our high-performance electronics.

Key Responsibilities:
  • Design and develop advanced packaging solutions for high-performance electronics
  • Collaborate with cross-functional teams to integrate packaging solutions with other design components
  • Develop and maintain packaging design tools and methodologies
  • Conduct thermal and electrical simulations to optimize packaging performance
  • Work with manufacturing teams to ensure smooth production of packaging solutions
Requirements:
  • 8.5+ years' experience in packaging with special emphasis on Advanced Packaging
  • Bachelor's in Electrical Engineering, Mechanical Engineering, Materials Science or Physics (Master's or PhD preferred)
  • Experience with package routing and layout using Cadence APD or similar tools
  • Well-developed knowledge of thermal and electrical simulations, ideally Ansys Workbench, Flotherm
  • Ability to run Signal Integrity and Power Integrity simulations
  • Experience with Advanced Packaging concept and technologies
  • Experience with Advanced Packaging reliability, modeling, and testing
  • Broad knowledge of 3D and heterogeneous assembly technology - HBM/CoWoS and others
  • Thorough understanding of semiconductor physics and various semiconductor processes
  • Excellent written and verbal communication skills and ability to work as a team player in a fast-paced environment
What We Offer:
  • Total compensation package that ranks among the best in the industry
  • Competitive base pay, restricted stock units, and quarterly bonus payments
  • Health benefits that begin day one, retirement savings plans, and an industry-leading IESPP program with a 6-month look back feature

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