Senior Packaging Engineer

3 days ago


Burnaby, British Columbia, Canada FHLB Des Moines Full time
Unlock Your Potential as a Principal Engineer- Packaging

We are seeking a highly skilled and experienced Principal Engineer- Packaging to join our team at Microchip Technology, Inc. As a key member of our organization, you will play a critical role in driving innovation and excellence in advanced packaging technology.

Key Responsibilities:

  • Collaborate with design teams to develop and implement advanced packaging solutions for Microchip's products.
  • Define and optimize signal, power, and thermal analysis flows for advanced packaging, working closely with EDA vendors to determine best tools and methodologies.
  • Work closely with design and architecture teams to achieve optimal outcomes on power, signal, and thermals for given designs.

Requirements and Qualifications:

  • 8.5+ years of experience in packaging with a focus on advanced packaging.
  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics (Master's or Ph.D. preferred).

What We Offer:

  • A competitive total compensation package, including base pay, restricted stock units, and quarterly bonus payments.
  • Excellent benefits, including health insurance, retirement savings plans, and an industry-leading IESPP program.
  • A dynamic and collaborative work environment with opportunities for growth and development.

Travel Time: 0% - 25%

Pay Range: $86,000 - $186,000 (dependent on location, skills, and experience)



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