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Photonic Component Process Engineer

3 months ago

Ottawa, Ontario, Canada Actalent Full time
Key Responsibilities:

Subject Matter Expert (SME) on all wire bonding and stud bumping specifications supporting our photonic component initiatives.
Engage with interdisciplinary teams to innovate and refine wire bonding techniques for our photonic products.
Spearhead the development of Accelerated Aging Burn-in methodologies for our photonic devices.
Collaborate with product and reliability engineers to analyze device failures during various phases of product development, including alpha and beta testing.
Create wiring diagrams for our Highly Accelerated Stress Testing (HAST) apparatus.
Maintain comprehensive documentation of all internally established processes.
Work alongside fellow engineers to diagnose and resolve technical challenges that arise.

Required Skills & Qualifications:

Essential Qualifications:

  1. A Bachelor's degree in Mechanical Engineering or Electrical Engineering is required.
  2. 3-5 years of relevant professional experience is necessary.
  3. Expertise in wire bonding techniques, including wedge bonding, copper stud bumping, and ball bonding.
  4. Familiarity with HAST Testing of photonic components is essential.
  5. Experience in developing test scripts for data acquisition and analysis is preferred.
  6. Proficient in using testing instruments such as tunable lasers, Optical Spectrum Analyzers (OSA), motorized stages, and Source Measure Units (SMU).

Preferred Qualifications:

  1. Knowledge of wire bond testing and characterization methods, including pull tests, shear tests, and wire bond strength evaluations.
  2. Experience in cleanroom laboratory environments is advantageous.
  3. Strong verbal and written communication skills are essential.
  4. Excellent analytical and problem-solving abilities to identify and address wire bonding challenges.
  5. Ability to thrive in a collaborative team setting.