Senior Packaging Engineer

1 week ago

Burnaby, British Columbia, Canada Microchip Technology Full time
Job Title: Principal Engineer- Packaging

We are seeking a highly skilled Principal Engineer- Packaging to join our team at Microchip Technology, Inc. This is a unique opportunity to be part of a 20,000-member team that works on the technology that powers the world around us.

Job Summary:

The successful candidate will engage in the following duties:

  • Work with design teams to determine best Advanced Packaging technology for Microchip's products.
  • Define flows for signal, power and thermal analysis for advanced packaging- includes working with EDA vendors to determine best tools and flows for our designs.
  • Work closely with design and architecture teams to achieve best possible outcomes on power, signal and thermals for given design.

This position requires someone comfortable with the many aspects of advanced packaging for Microchip products, and who enjoys the challenge of leading integration driven innovations across geographically disperse teams in pursuit of taking advantage of Advanced Packaging.

Requirements/Qualifications:

Education:

  • Must have 8.5+ years' experience in packaging with special emphasis on Advanced Packaging.
  • Must have a Bachelors in Electrical Engineering, Mechanical Engineering, Materials Science or Physics (Masters or PhD preferred).

Job requirements:

  • Experience with package routing and layout using Cadence APD or similar tools.
  • Well-developed knowledge of thermal and electrical simulations, ideally Ansys Workbench,Flotherm.
  • Ability to run Signal Integrity and Power Integrity simulations.
  • Experience with Advanced Packaging concept and technologies.
  • Experience with Advanced Packaging reliability, modelling and testing.
  • Ideally has broad knowledge of 3D and heterogeneous assembly technology - HBM/CoWoS and others.
  • A thorough understanding of semiconductor physics and various semiconductor processes is a plus.
  • Ability to problem solve and work with Die team to iterate through the package design process.
  • Excellent written and verbal communication skills and ability to work as a team player in a fast-paced environment. Good presentation skills.
  • Self-motivated, attention to detail, ability to prepare technical reports by collecting, analyzing, and summarizing information, as well as write technical specifications and procedures.
  • Excellent time management skills.

Travel Time: 0% - 25%

Pay Range: We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry-leading IESPP program with a 6-month look back feature. Find more information about all our benefits at the link below:

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