ASIC Package Engineering Intern/Co-Op

3 weeks ago


Markham, Ontario, Canada AMD Full time
Job Description

At AMD, we're pushing the limits of innovation to solve the world's most important challenges. We're seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with our engineers in bringing new and advanced packaging technology to reality.

Key Responsibilities:
  • Support Package design and Package Development Engineers in prioritizing and optimizing new projects
  • Complete substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates
  • Assign projects related to design verification implementation to ensure design performance, quality, and efficiency
  • Analyze yield and defect metrics to ensure design performance and help improve the yield
  • Evaluate, benchmark packaging materials, and interact with partners to achieve the most cost-efficient design and materials for the best performance and yield requirements
Requirements:
  • Currently enrolled in a Canada-based University in a Bachelor's degree program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
  • Knowledge/experience with technical skills such as transmission lines and electric circuits, package, silicon, or PCB design software, scripting languages (Perl, Python, SQL), semiconductor theory, and packaging process/technology
What We Offer:
  • Hands-on experience that will give you a competitive edge
  • Collaboration with AMD leaders, one-on-one mentorship, and networking events
  • Opportunity to work with a diverse group of employees in a high-energy work environment


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