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ASIC Package Engineering Intern/Co-Op
1 month ago
We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with our team of engineers in bringing new and advanced packaging technology to reality.
Key Responsibilities:
- Support Package design and Package Development Engineers in prioritizing and optimizing new projects
- Train to complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates
- Assign projects related to design verification implementation to ensure design performance, quality and efficiency
- Analyze yield and defect metrics to ensure design performance and help improve the yield
- Evaluate, benchmark packaging materials and interact with partners to achieve the most cost-efficient design and materials for the best performance and yield requirements
Requirements:
- Currently enrolled in a Canada based University into a Bachelor's degree program majoring in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
- Knowledge/experience with technical skills such as transmission lines and electric circuits, package, silicon or PCB design software, scripting languages, semiconductor theory and packaging process/technology, and data analytics and data visualization tools
About AMD:
AMD is a leading technology company that designs and manufactures innovative products that accelerate next-generation computing experiences. We are committed to building great products that transform lives and enrich our industry, communities, and the world.
Benefits:
AMD offers a comprehensive benefits package that includes competitive salary, comprehensive health insurance, retirement savings plan, and paid time off.
