Microelectronic Packaging Design Engineer

1 month ago

Canada Sanmina Full time

Job Title: Microelectronic Packaging Design Engineer

Job Summary:

Sanmina is seeking a highly skilled Microelectronic Packaging Design Engineer to join our team. As a key member of our Global Design Engineering Team, you will be responsible for designing and developing microelectronic packaging solutions for our customers.

Key Responsibilities:

  • Design and develop microelectronic packaging solutions for RF, microwave, and optical applications.
  • Collaborate with cross-functional teams to develop and implement packaging solutions that meet customer requirements.
  • Conduct thermal, structural, and reliability analysis to ensure packaging solutions meet performance and reliability requirements.
  • Develop and maintain documentation, including design specifications, drawings, and bills of materials.
  • Interface with manufacturers and suppliers to source custom components and materials.
  • Support business development initiatives, including preparing marketing materials and proposals.

Requirements:

  • Bachelor's degree in Mechanical Engineering, Physics, or related field.
  • Minimum 5 years of experience in electronic hardware design and packaging.
  • Experience in Wafer Level Packaging (WLP) and Chip Scale Packaging (CSP).
  • Background in microelectronic technologies, materials, components, and manufacturing methods.
  • Proficient in computer-aided design software and tools, including AutoCad and SolidWorks.
  • Familiar with packaging and substrate design software, including Cadence Allegro Package Designer Plus.
  • Familiar with commercial FEA software and tools for thermal, structural, and fatigue analysis.

About Sanmina:

Sanmina is a leading provider of design, manufacturing, and logistics services for the global electronics industry. We are committed to delivering high-quality products and services to our customers, and we are seeking talented individuals to join our team.

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