Senior Microelectronic Design Engineer

5 days ago

Ottawa, Ontario, Canada Sanmina-SCI Systems de México Full time

Job Summary

Sanmina-SCI Systems de México is seeking a highly skilled Senior Microelectronic Design Engineer to join our team. As a key member of our Global Design Engineering Team, you will be responsible for leading technology and product development programs from initial technology selection and concept definition through detailed design, prototyping, qualification, and volume manufacturing phases.

Key Responsibilities

  • Lead product development teams in microelectronic design and engineering, collaborating with electrical/RF engineering, optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering, and test engineering teams to meet customer requirements and specifications.
  • Conduct industry assessments and select microelectronic technologies and define design concepts based on product applications, requirements, and specifications.
  • Design and engineer microelectronic packages and modules, integrating material selections, substrate layout, and designs, mechanical, thermal, and reliability aspects, electrical (RF), optical, test, and process engineering for volume manufacturing.
  • Manage product documentation, including design specifications, drawings, Bill of Materials, and documentation release by engineering change order (ECO).
  • Define specifications and requirements and coordinate with manufacturers and suppliers for outsourced custom components.
  • Oversee and support engineering product verification, ensuring compliance to product requirements.
  • Drive business development initiatives, including interfacing with potential and existing customers, preparing marketing materials, proposals, and quotations.
  • Lead the product development process through to manufacturing implementation.

Requirements

  • Bachelor's Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging, including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications.
  • Minimum of 8 years' of relevant industry experience.
  • Proficient in computer-aided design software and tools (AutoCad, SolidWorks).
  • Experience with commercial FEA tools and supporting analysis.
  • Experience with packaging and substrate design software (Cadence Allegro Package Designer Plus).
  • Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
  • Experience in end-to-end product development and manufacturing implementation.
  • Security clearance is an asset.
  • Customer-focused with strong communication skills and the ability to work within a multidisciplinary product development team in a fast-paced and challenging environment.

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