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Senior Microelectronic Design Engineer

2 months ago

Ottawa, Ontario, Canada Sanmina-SCI Systems de México Full time
Job Description

Company Overview

Sanmina-SCI Systems de México is a leading technology division of Sanmina Corporation, specializing in advanced microsystems technologies, RF, microelectronic, and optical components and integrated subsystems.

Job Summary

We are seeking a highly skilled Senior Microelectronic Design Engineer to join our team and support technology and product development programs from initial technology selection and concept definition through detailed design, prototyping, qualification, and volume manufacturing phases.

Key Responsibilities

  • Lead product development programs in microelectronic design and engineering as part of a multidisciplinary product development team, including electrical/RF engineering, optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering, and test engineering.
  • Assess industry trends and select microelectronic technologies and define design concepts based on product applications, requirements, and specifications.
  • Design and engineer microelectronic packages and modules, integrating elements of material selections, substrate layout, and designs, mechanical, thermal, and reliability, electrical (RF), optical, test, and process engineering for volume manufacturing.
  • Manage product documentation, including design specifications, drawings, Bill of Materials, and documentation release by engineering change order (ECO).
  • Define specifications/requirements and coordinate with manufacturers/suppliers for outsourced custom components.
  • Oversee and support engineering product verification, ensuring compliance to product requirements.
  • Lead the product development process through to manufacturing implementation.

Requirements

  • Bachelor's Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging, including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications.
  • Proficient in computer-aided design software and tools (AutoCad, SolidWorks).
  • Experience with commercial FEA tools and supporting analysis.
  • Experience with packaging and substrate design software (Cadence Allegro Package Designer Plus).
  • Experience in end-to-end product development and manufacturing implementation.
  • Security clearance is an asset.
  • Sanmina welcomes and encourages applications from persons with disabilities.