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Lead Engineer – Signal and Power Integrity Specialist

3 months ago

Ottawa, Ontario, Canada Huawei Full time

Join our dynamic team at Huawei as a Lead Engineer – Signal and Power Integrity Specialist.

Key Responsibilities:

  • Oversee the simulation, assessment, validation, and enhancement of package (system-level) connections, delivering competitive solutions aligned with product specifications.
  • Contribute to the development of analytical specifications and methodologies, offering design recommendations, testing insights, or innovative analytical techniques for package (and system) enhancement, power supply architecture, and interface evaluation.
  • Lead the resolution of technical challenges related to power integrity (PI) and signal integrity (SI) within projects, fostering process advancements through design refinement.

Qualifications and Skills:

  • Possess a Bachelor’s degree or higher in electronic engineering, electromagnetic theory, microwave technology, radio frequency, or a related discipline.
  • Bring a minimum of 10 years of professional experience in package design electrical performance, with extensive involvement in mass production initiatives, PI/SI simulation, optimization, testing, and analysis.
  • Expertise in high-speed interface evaluation, including HBM, DDRx/GDDRx, Serdes, PCIE, and other intellectual property simulation design experience.
  • Proficient in high-speed electronic packaging and system power design optimization, encompassing power integrity, power transfer, through-current, and power distribution network (PDN) collaborative design and enhancement experience.
  • Specialized knowledge in signal integrity, power integrity, and electromagnetic compatibility simulation and validation methodology development.
  • Thorough understanding of high-frequency characteristics of components and materials, common high-speed bus and interface standards, and familiarity with packaging processes and design.
  • Self-motivated and proactive; values collaboration and knowledge sharing; possesses strong communication skills and effective teamwork capabilities.
  • Experience with 2.5D and 3D packaging projects is considered advantageous.

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