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Microelectronics Process Engineer
3 months ago
Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle. At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few. Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.
Job PurposeThe Microelectronics Process Engineer will manage, develop and implement new processes to be used in our manufacturing environment - embracing advanced RF, optical and microelectronic components, modules and sub-systems.
Nature of Duties / Responsibilities- Work directly with RF, optical and microelectronic product design and development teams to provide process engineering solutions in support of new product development, with subsequent NPI and manufacturing support.
- Wafer level assembly experience would be an asset for this position. Strong project/customer management skills required.
- Supports new technology research and development pertaining to optical and microelectronic process solutions.
- Manages projects and timelines in order to meet milestones and deliverables of various customer projects.
- Application program on high-end automated assembly equipment (dispensers, die bonders, wire bonders, optical aligners, etc.).
- Develops processes related to the assembly of Optical and Microelectronic modules, such as:
- SMT + flip chip assembly (multi-chip modules)
- Flip chip underfill
- Epoxy dispensing, high accuracy die bonding
- Semiconductor die and microelectronic components bonding and interconnection (wire bond)
- Packaging encapsulation
- Optical active/passive alignment
Requires a University degree in Engineering (Mechanical or Photonics preferred). 12+ years' experience in a Process or Manufacturing Engineering support role. Experience with Optical and Microelectronic technologies and processes. Experience with wafer level processing (wafer level packaging, backend wafer processing) would be preferred. Experience with AutoCad/SolidWorks. Hands-on build experience would be an asset (handling bare dies or miniature components with tweezers, use of microscopes, camera systems, etc.). Experience with equipment programming (auto dispensers, pick and place machines, welders, etc.) would be beneficial. Exposure to product design and development phases would be beneficial. A background in the execution of "best practice" process control is required. Experience with lean manufacturing principles. Experience with DFM and FMEA would be an asset. Experience with Microsoft Office Suite (Word, Excel, PowerPoint).
Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.
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