Microelectronic Packaging Design Engineer

Microelectronic Packaging Design Engineer Join to apply for the Microelectronic Packaging Design Engineer role at Sanmina Microelectronic Packaging Design Engineer 1 year ago Be among the first 25 applicants Join to apply for the Microelectronic Packaging Design Engineer role at Sanmina Job DescriptionAdvanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle. Job DescriptionAdvanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.Job PurposeThe Microelectronic Design Engineering team, as part of Sanmina’s Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering.We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.Nature Of Duties/ResponsibilitiesSelect microelectronic technologies and definition of design concepts, based on product applications, requirements and specifications. Design microelectronic packages & modules, including integrating elements of material selections, substrate layout and designs, mechanical, thermal as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing. Contribute to microelectronic design and engineering activities as part of a multidisciplinary product development team including electrical/RF engineering optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, in line with customer requirements and specifications. Generate product documentation including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO). Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components. Perform and support engineering product verification, ensuring compliance to product requirements. Support business development initiatives including interfacing with potential and existing customer, preparation of marketing materials, proposals and quotations. Support turnkey product development process through to manufacturing implementation. Education And ExperienceBachelor’s Degree in Mechanical Engineering, Physics, Material Science, or other relevant degree with experience in electronic hardware design and packaging including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications. Minimum of 8 years’ of relevant experience. Proficient with packaging and substrate design software (Cadence Allegro Package Designer Plus). Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods. Experience in end-to-end product development and manufacturing implementation. Familiar with commercial FEA tools and supporting analysis. Security clearance is an asset. Must be customer delivery focused, have strong communication skills, and be able to work well within a multidisciplinary product development team in a fast-paced and challenging environment. Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process. Seniority level Seniority level Mid-Senior level Employment type Employment type Full-time Job function Job function Information Technology Industries Appliances, Electrical, and Electronics Manufacturing Referrals increase your chances of interviewing at Sanmina by 2x Sign in to set job alerts for “Packager” roles. 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