Thermal Engineer

Location: Markham, ON Department: Engineering Posted: 8/11/2026 Location Name: HSIO-Markham

Wage Max: 140,000.00 Wage Min: 85,000.00

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world’s largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.

We are seeking a highly motivated and experienced Thermal Engineer – Liquid Cooling to join our Front-End I/O Active Thermal Solutions team. This role focuses on the design, simulation, validation, and optimization of liquid-based active cooling solutions for high-speed interconnect and front-panel I/O systems used in data center and high-performance computing environments. The ideal candidate will work closely with customers and cross‑functional engineering teams to define thermal requirements, develop robust liquid cooling architectures, perform advanced thermal simulations, and validate designs through laboratory testing. This role delivers production‑ready thermal solutions that meet performance, reliability, and manufacturability targets.

Key Responsibilities

Design & Development

• Architect and develop liquid‑cooled cold plates for high‑density front‑end I/O connector and interconnect applications.
• Design and optimize microchannel structures, flow paths, and cold plate geometries to maximize thermal performance while minimizing pressure drop.
• Select and integrate materials compatible with high heat flux, corrosion resistance, and long‑term reliability in data center environments.
• Collaborate with connector and mechanical design teams to ensure mechanical integration, tolerance alignment, and manufacturability.

Customer Engagement

• Work directly with customers to gather thermal boundary conditions, system constraints, and performance requirements.
• Translate customer needs into thermal simulation strategies, validation plans, and design trade‑offs.
• Serve as a technical interface to explain thermal concepts, design decisions, and test results.

Thermal Simulation & Analysis

• Develop and execute CFD thermal models using tools such as ANSYS Icepak, FloTHERM, or equivalent.
• Analyze temperature distribution, heat dissipation, and fluid flow behavior in liquid cooled front‑end I/O environments.
• Perform sensitivity studies and optimization analyses to ensure designs meet performance margins.

Experimental Validation

• Partner with lab and test engineers to plan and conduct thermal performance and flow validation testing.
• Correlate experimental data with simulation results to validate and refine models.
• Conduct root‑cause analysis and iterative design improvements to resolve thermal issues.

Optimization & Technical Reporting

• Optimize thermal designs considering performance, cost, reliability, and manufacturability.
• Prepare detailed technical reports and presentations summarizing simulations, test results, and design recommendations.
• Present optimized solutions and findings to customers and internal stakeholders.

Qualifications

Education & Experience

• Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or a related field.
• Strong experience in thermal design or analysis for electronic systems, interconnects, or data center hardware.

Technical Skills

• At least 4 years of industry experience in active and advanced cooling technologies, including cold plates, heat exchangers, heat pipes, or vapor chambers. (Must Have)
• Experience developing liquid cooling solutions for high‑speed connectors, modules, or front‑panel I/O systems. (Must Have)
• Strong proficiency with CFD and thermal simulation tools (ANSYS Icepak, FloTHERM, or similar). (Must Have)
• Experience with thermal instrumentation and data acquisition, including thermocouples, flow sensors, and IR imaging.
• Experience with CAD tools such as SolidWorks, Creo, or equivalent. (Must Have)
• Solid understanding of heat transfer, fluid dynamics, and electronic packaging.
• Excellent written and verbal communication skills for cus