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Senior Photonics Packaging Engineer

1 day ago

Toronto, Ontario, Canada Jabil Full time

Job Summary
Develops and implements production/processing methods and controls to meet quality standards in the most efficient manner for Photonic and Electronic Advanced Packaging.

Monitors the assembly process; troubleshooting problem processes and assisting in resolving quality issues. Is the technical expert on various projects/productions jobs and process as required.

Essential Duties And Responsibilities

  • Develop new assembly processes including material selection, methods and continuous improvement.
  • Operate production and test equipment in a prototype/NPI line.
  • Work with colleague engineers, technicians and operators for NPI and prototype production.
  • Act as equipment prime for specific machines, driving procurement, maintenance, spares and service as required.
  • May lead the startup of new/existing projects/production jobs, optimizing cost, efficiency and quality.
  • May lead the process control and maintain appropriate documentation.
  • Monitor the assembly/molding process running in production; troubleshoot problems associated with processes, and assist in resolving quality issues.
  • Establish detailed processes for new product lines; document product development and changes; evaluate new product performance; and monitor new tool design.
  • Debug significant complex problems in new systems, tooling and automation.
  • Design major experiments to enhance processes as well as improve yields and utilization through reduced cycle and efficient set-up.
  • Lead and implement major maintenance changes in process improvements; propose or specify repair alteration of automation while ensuring adequate documentation is maintained.
  • Provide functional and technical mentoring to process technicians and other process engineers.
  • Maintain a clean and safe work environment; supporting all company safety programs and initiatives.
  • Support all company safety and quality programs and initiatives.
  • Apply and support Lean Manufacturing principles.
  • May perform other duties and responsibilities as assigned.

Job Qualifications
KNOWLEDGE REQUIREMENTS

  • At least five years of compatible experience with advanced packaging, particularly flip-chip, die bond, wire bond and alignment.
  • Master level or above degree in related discipline.

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