Signal & Power Integrity Engineer – Optical Communications

6 days ago

Ottawa, Ontario, Canada Ranovus Full time

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

Signal and Power Integrity Engineer – Optical Communications

Ranovus is seeking a highly motivated Signal and Power Integrity Engineer to support the development of advanced board, package, and chip designs that power next‑generation optical communication systems. In this role, you will contribute to the design, analysis, and validation of high‑speed interconnects and power delivery networks that enable industry‑leading optical products.

This position is ideal for a person who is passionate about high‑speed design, electromagnetic modeling, and solving complex signal‑integrity challenges in cutting‑edge hardware systems.

Key Responsibilities

  • Drive the development and implementation of innovative SI/PI solutions for Ranovus optical products, ensuring robust performance across chip, package, and board levels.
  • Perform advanced simulations for signal integrity (SI) and power integrity (PI), including time‑domain, frequency‑domain, and electromagnetic modeling.
  • Conduct hands‑on high‑speed signal validation and verification, including material characterization, de‑embedding, fixture removal, and component‑level analysis.
  • Collaborate cross‑functionally with hardware design, system architecture, silicon engineering, and PCB layout teams to optimize SI/PI performance based on simulation and measurement data.
  • Develop and refine power delivery network (PDN) models, performing simulation and characterization across die, package, board, and voltage‑regulator domains.
  • Document engineering processes, methodologies, and test procedures to support repeatability, scalability, and cross‑team knowledge sharing.

Qualifications

Education

  • Master's or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.

Technical Background

  • Coursework or experience in electronics, circuit design, and programming.
  • Strong understanding of circuit design principles, signal propagation, and high‑speed interconnect behavior.
  • Familiarity with chip‑level physical integration and layout concepts.

Tools & Modeling Skills

  • Proficiency with circuit simulation tools such as SPICE and MATLAB.
  • Experience with industry‑standard SI/PI and EM tools, including:
    • Cadence Allegro
    • Ansys HFSS
    • CST Studio Suite
    • Ansys Siwave
    • Cadence Sigrity
  • Understanding of IBIS, IBIS‑AMI, and S‑parameter models.

Soft Skills

  • Strong analytical and problem‑solving abilities.
  • Ability to work effectively in a collaborative, multidisciplinary engineering environment.
  • Clear communication skills and attention to detail.

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