Staff Mechanical-Thermal/FEA Engineer

22 hours ago

Canada Nokia Global Full time $120,000 - $180,000 per year
Description

We are seeking a highly experienced Mechanical Engineer to execute the mechanical and thermal design of optical pluggable modules and other telecom products. This role combines hands-on engineering to develop an optical plug from concept and simulation to prototyping and production. The ideal candidate will bring deep expertise in thermal modeling, FEA, CAD design, and manufacturing support, along with a strong understanding of industry standards and electro-mechanical best practices.
 

Responsibilities

Key Responsibilities

Design & Development

  • Contribute to the mechanical design of optical pluggable modules, balancing thermal, structural, and manufacturability requirements.
  • Perform and oversee thermal simulations and FEA.
  • Execute FEA to optimize the die attach process.
  • Collaborate with SI team to develop new die interconnect solutions to enable bandwidths more than 140GHz.
  • Create and review CAD models and detailed drawings.
  • Conduct tolerance analysis, stress analysis, and thermal DVT.
  • Develop prototypes and support transition to production with minimal redesign.
  • Support New Product Introduction (NPI) by ensuring smooth handoff from design to production.
  • Interface with suppliers and contract manufacturers to resolve mechanical and integration issues.
  • Author and review ECOs, BOMs, and technical documentation.

Define and validate labeling, packaging, and regulatory compliance requirements.

 

Qualifications

Required Qualifications

  • Bachelor's or Master's degree in Mechanical Engineering.
  • 10+ years of experience in mechanical design, including optical or telecom hardware.
  • Strong expertise in thermal design, FEA, and CAD modeling (Creo preferred).
  • Experience with die stress/strain simulations
  • Excellent communication, leadership, and problem-solving skills.

Preferred Qualifications

  • Experience with optical transceiver (e.g., QSFP, OSFP) and ASIC packaging.
  • Knowledge of compliance and shock/vibration testing for telecom application.
  • Knowledge of advanced substrate technologies such as organic build up, LTCC, HTCC, and high-performance PCB laminates.

Why Join Us

  • Lead the development of next-generation optical technologies.
  • Collaborate with a world-class team of engineers and innovators.
  • Enjoy a dynamic, supportive, and growth-oriented work environment.

     

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