Silicon Photonics Packaging Co-op/Intern

12 hours ago

Canada Nokia Global Full time
Description

Position Title: Silicon Photonics Packaging Co-op/Intern
Number of Position(s): 1
Duration: 4 Months
Date: May - Aug 2026
Location: Onsite - Ottawa, CA

Education Recommendations

Currently a candidate for a Master's or PhD degree in Electrical Engineering, Physics, Applied Physics, or other similar field with an accredited school in US.  
 

Responsibilities
  • Develop advanced semiconductor and optical packaging processes in-house or with contract manufacturers.
  • Design optical transceiver packages in collaboration with cross-functional teams to meet performance and manufacturing requirements.
  • Define and maintain Design Rules and ensure compliance with Design for Manufacturing standards.
  • Perform mechanical and thermal simulations, tolerance analysis, and characterization.
  • Lead package debug activities during validation and qualification phases.
  • Plan and execute prototype builds to support early design validation.
  • Apply deep knowledge of advanced packaging principles and stay current with emerging technologies.
     
Qualifications
  • Experience with package and process design/development from design to production.
  • Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
  • Experience with documentation of fabrication, inspection, and assembly processes.

  • Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

    It would be nice if you also had:

  • Knowledge of optical packaging, including epoxies, non-hermetic and high-volume packaging, plus thermal analysis for 2.5D/3D packages.
  • Experience in semiconductor back-end processes: chip/wafer assembly and packaging.
    Familiarity with high-speed electronics or laser package design.
  • Skills in thermo-mechanical simulations (e.g., ANSYS) and metrology techniques (SEM/XSEM, confocal microscopy, acoustic imaging).
  • Understanding of optical packaging design and simulations using free-space optics or fiber coupling.
     

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