Printed Circuit Board Design Engineer

1 week ago

Toronto, Ontario, Canada Sanmina Full time $120,000 - $180,000 per year

Job Description

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.

At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.

Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

Job Purpose

The design engineering group provides complete end-to-end product development solutions to a variety of customers. These product solutions include development of test and measurement modules, 4&5G macro frequency variants, optical modules, etc. The team delivers project solutions from concept definition through to volume manufacturing.

The design team is seeking an experienced PCB Layout Designer. Responsibilities include the implementation and layout of complex RF and electro optical designs. The candidate will be expected collaborate with a cross function product development team.

Nature of Duties/Responsibilities

  • Execution of schematic capture and implementation of PCB layouts, including the creation of component symbols and footprints.
  • Provide feedback and guidance on substrate technology and processes.
  • Layout and build files including PCB design, ceramic substrate design, organic substrate design, and complex multi-layer packaging design.
  • Complete simulations of active bias power supplies and other complex analog circuits.
  • Perform signal integrity simulations and implementation into layout of high speed digital and high frequency analog signal paths.
  • Perform power integrity simulations and implementation into layout of power and control signal paths.
  • Develop system power trees and DC power budgets.
  • Perform, review and implement design for manufacturing analysis and reports.
  • As part of integrated product development team, participate in every phase of product development.

Education and Experience

  • Relevant degree in electrical engineering.
  • Minimum 8 years of relevant experience in an engineering design capacity. Candidates with less experience will be considered and are encouraged to apply.
  • Experience with PCB development and understanding of PCB constraints is required.
  • Experience with Cadence CIS and Cadence Allegro is required.
  • Understanding of analog and digital electronics is required.
  • Experience with Cadence APD+, Mentor Graphics tools, or Altium designer is an asset.
  • Experience with HDI (High Density Interconnect) is an asset.
  • Familiarity with PCB fabrication processes, DFM best practices and IPC Certification (CID, CID+) are all an asset.
  • Experience with circuit simulation tools such as Spice, Hyperlynx, ADS suite or equivalent is an asset.
  • Understanding of advance timing, clock synchronization and transceiver design is an asset.

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