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Description Our Company is built on employee mutual commitment and respect, enthusiasm and progress. Teledyne Digital Imaging is a subsidiary of Teledyne Technologies Inc., a U.S. publicly listed enterprise, and specializes in the manufacture, design, research and development of high performance image sensors and modular expandable cameras. Teledyne Digital Imaging's products are used worldwide in machine vision, document scanning, image capture, surveillance, process monitoring, manufacturing inspection, medical imaging, and multi media. – We like to do what hasn’t been done before. We push the global boundaries of science and technology in our desire to be #1 in the markets we serve. – We have a deep bench strength of technical staff who lead the imaging industry, both in terms of advanced education and in leadership of global imaging standards committees. We regularly work with customers who are leaders in their own industries. – We have development or direct sales offices in over a dozen countries and sell to the largest industry players in almost all industrialized countries globally. Our teams regularly work in partnership with other locations of our organization or with global partners to produce novel new products. – We produce highly successful imaging products for use in a myriad of interesting applications – such as cell phone display inspection, assisting in medical diagnosis, genetic mapping, exploring our galaxy, enabling autonomous vehicles, or facilitating dental health, just to name a few.Position SummaryWe are currently seeking a highly talented and motivated junior to senior Electronics Engineer to be part of our high-end scanning products R&D team. As a successful candidate for this role, you have problem-solving and troubleshooting skills, good communication skills and a desire to tackle challenges. You will use your skills and initiative within a team environment to develop novel camera designs for world-class imaging products.Position requirementsB.Sc. or higher in electrical or electronic engineering.Minimum three years demonstrated ability to develop PCBs and interconnects.Desire to learn new technologies and innovate.Ability to interact with mechanical, FPGA, embedded software, and test engineers.Schematic capture and PCB layout supervising.Selection of electronic parts and supporting procurement.Design for reliability and robustness.Technical analysis documentation with diagrams and calculations.Design of mixed-signal PCBs and board to board interconnects using the latest FPGAs, uCs, DDR memories, clock generators, cables, and connectors.Understanding design for signal and power integrity.Good knowledge of switching power supply design.Experience with transistors, opamps, ADCs and DACs.Knowledge of the most common communication interfaces such as I2C, SPI, UART, GigE.Participate in all aspects of project life cycle including concept definition and trade-offs, requirements development, design, test, release for production, and customer support.Asset qualifications:Experience with Mentor Graphics PCB design tools.High-speed digital design experience with FPGA blocks including multi-gigabit transceivers, PLLs, memory and uC interfaces, hard and soft processing cores.Camera electronics design experience.Mentoring of junior engineers.High-speed PCB simulations.IC package design.Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions..
