Ingénieur en Procédés d'Assemblage Photonique

Description Photonics Assembly Process EngineerPosition Overview: We are seeking a highly motivated and detail-oriented Photonics Assembly Process Engineer to join our photonics component team, specializing on advanced manufacturing processes for telecommunications applications. You will play a key role in the development of assembly processes for photonic components and systems, such as optical transceivers and other critical devices that enable high-speed communication networks. You will collaborate with cross-functional teams to ensure the scalability, reliability, and performance of photonic products used in cutting-edge telecommunication systems.Key Responsibilities:Design, implement, and optimize assembly processes from the R&D phase through production introduction, including:Wafer-level processes (e.g., wafer bumping, bonding, thinning and singulation).Flip chip bonding for high-performance interconnects.Wire bonding for reliable electrical connections.Active alignment to achieve precise optical performance.Die bonding for secure placement and integration of photonic components.Work closely with design engineers, laboratory technologists, supply chain partners and contract manufacturers to ensure seamless integration of new processes.Support the selection, qualification, and commissioning of assembly equipment to develop production capacity and ensure process scalability.Develop and maintain process documentation, including assembly plan, process flow diagrams, and statistical process control (SPC) documentation.Perform failure analysis and root cause investigations for process-related defects, implementing corrective actions to improve product quality.Qualifications:Bachelor’s degree in Mechanical Engineering, Materials Science, Engineering Physics, or a relevant field.A Master’s degree or PhD is a plus but not required.0–5 years of experience in a related industrial or research environment.Hands-on experience with photonics assembly processes, optical systems, or semiconductor packaging is highly desirable.Strong analytical and problem-solving skills with attention to details.Excellent communication and teamwork skills, with the ability to work in a cross-functional environment.Willingness to travel occasionally to support supplier visits, equipment installation and collaboration with contract manufacturers.Passion for innovation and learning new technologies.Pay Range: The salary range for this role in Quebec City is $55, 700 - $88, 900Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.Not ready to apply? Join ourto get relevant job alerts straight to your inbox.At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.Ciena is an Equal Opportunity Employer, including disability and protected veteran status.If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.