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Senior RF and Analog Design Engineer
2 months ago
Location: Canada
Job Type: Full-Time
Experience Level: Senior-Level
Position Overview:
We are seeking an experienced RF and Analog Design Engineer to contribute to the development of state-of-the-art multi-tens of GHz Transimpedance Amplifiers (TIAs) and optical interface chips. These components are crucial in advancing our high-performance equalizers and have established our TIAs as best-in-class for coherent long-haul, metro systems, and PAM4 data center systems.
Key Responsibilities:
Circuit Design & Leadership:- Lead the design and development of cutting-edge transimpedance amplifiers (TIAs) using Silicon Germanium (SiGe) BiCMOS technology.
- Provide technical leadership to ensure designs surpass industry standards.
- Develop transmission line and millimeter-wave structures to enhance performance.
- Design high-performance broadband analog circuits for optical front-end receivers.
- Design linear regulators, AGC loops, current/voltage sensors, and bandgaps.
- Develop microarchitecture for chips and major circuit blocks, guiding a team to implementation.
- Collaborate with teams for post-silicon validation, qualification, and transition to mass production.
- Work with management and marketing to translate specifications into circuit designs.
Education:
- Bachelor's degree in Electrical Engineering with 15+ years of experience, OR
- Master's degree in Electrical Engineering with years of experience, OR
- PhD in Electrical Engineering with 10+ years of experience in RF/Analog Receiver/TIA design.
Technical Skills:
- Proven IC design experience, including chip tape-out and lab evaluation.
- Proficiency in EDA CAD tools and Analog Custom Layout.
- Experience in measuring IC performance and correlating simulations to measurements.
- Strong understanding of transistor-level design, device physics, and control/feedback loop stability analysis.
Preferred Experience:
- Experience in AGC loop design, high precision analog circuits, CTLE design, and package-system integration.
- Experience with SiGe BiCMOS and other semiconductor technologies.
- Experience leading multidisciplinary teams and projects.
- Proven track record as a chip lead with success in silicon and mass production.
- Ability to translate chip-level specifications into architectural designs.
- Strong communication, presentation, and documentation skills.
- Ability to mentor junior designers and foster a collaborative environment.