Senior Quantum Packaging Engineer

16 hours ago

Burnaby, British Columbia, Canada D-Wave Full time

Overview

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D-Wave, a leader in the development and delivery of quantum computing systems, software, and services, seeks an experienced IC packaging development engineer to join our Processor Development team. As a key member of this team, you will contribute to the development of advanced cryogenic microelectronic packages for superconductor-based quantum computers.

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About the Role

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You will work closely with quantum processor scientists, superconducting IC designers, and mechanical, cryogenic, and electrical engineers to arrive at the requirements for next-generation cryogenic quantum computing processor packaging technologies. Your responsibilities will include evaluating, developing, and debugging these technologies, as well as working with an integrated product team to drive package development, electrical design, modeling, and characterization.

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Your Key Responsibilities

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  • Develop and manage relationships with outside vendors and collaborators who will help build flip-chip assemblies.">
  • Perform cryogenic testing of flip-chip assemblies in D-Wave's lab to assess robustness and functionality.">
  • Use test results to develop and validate a flip-chip packaging process from chip pad metallization to PCBs to final packaged chip.">
  • Work with D-Wave's R&D leadership and technical team to ensure secure access to the developed process.">
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Your Requirements

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To succeed in this role, you will need:

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  • Bachelor's degree in Electrical or Mechanical Engineering, Applied Physics, or a related field, along with 5-10 years of experience in a similar position.">
  • Mastery of EM, transmission lines, and microwave theory, including understanding of frequency and time domains and knowledge of high-speed signaling.">
  • Experience with VNA and TDR measurements, high-speed electronic packaging for digital and analog ICs, and 2-D and 3-D EM simulation tools such as Ansys HFSS.">
  • Familiarity with thermal and mechanical analysis of IC package development, 2.5D/3D package development, flip-chip, bump bonding, wafer level, and package level assembly processes, materials, and equipment.">
  • Broad exposure to niche applications such as MEMS or MOEMS packaging, photonics/optoelectronics, micro- and nano-fluidics, sensors, thick film/ceramic, heterogeneous integration, and IC packaging materials background including characterization and failure analysis.">
  • Strong communication, presentation, and documentation skills, as well as the ability to work both independently and with multi-function teams.">
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A D-Waver's DNA

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We're looking for someone who embodies the following qualities:

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  • We challenge the status quo and explore new possibilities.">
  • We communicate openly and honestly, valuing empathy and respect in all interactions.">
  • We hold ourselves accountable for delivering results and driving progress.">
  • We motivate and engage our teams to push beyond what's thought possible.">
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What We Offer

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In return for your expertise and dedication, we offer:

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Salary: $127,000 - $190,000 per year

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We believe in providing competitive pay and benefits to support your personal and professional growth. Our compensation philosophy is centered around creating a culture where people can thrive and make their best contributions.

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EEO Policy

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D-Wave is an equal employment opportunity (EEO) employer that values diversity and inclusion. We welcome applicants from diverse backgrounds and promote a workplace free from discrimination and harassment.

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Contact Us

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