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Microelectronic Design Lead
2 months ago
Sanmina Corporation is seeking a highly skilled Senior Microelectronic Design Engineer to join our team in the Advanced Microsystems Technologies division. As a key member of our Global Design Engineering Team, you will play a critical role in the development of cutting-edge microelectronic technologies and products.
Key Responsibilities- Product Development Lead: Lead multidisciplinary product development teams in microelectronic design and engineering, including electrical/RF engineering, optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering, and test engineering.
- Technology Assessment and Selection: Assess and select microelectronic technologies and define design concepts based on product applications, requirements, and specifications.
- Design and Engineering of Microelectronic Packages and Modules: Design and engineer microelectronic packages and modules, including integrating elements of material selections, substrate layout and designs, mechanical, thermal, and reliability engineering.
- Product Documentation and Management: Manage product documentation, including design specifications, drawings, Bill of Materials, and documentation release by engineering change order (ECO).
- Component Sourcing and Verification: Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components, and oversee and support engineering product verification to ensure compliance to product requirements.
- Business Development and Product Management: Drive business development initiatives, including interfacing with potential and existing customers, preparation of marketing materials, proposals, and quotations, and lead the product development process through to manufacturing implementation.
- Education and Experience: Bachelor's Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging, including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications.
- Minimum of 8 years' of relevant industry experience.
- Proficient in computer-aided design software and tools (AutoCad, SolidWorks).
- Experience with commercial FEA tools and supporting analysis.
- Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
- Experience in end-to-end product development and manufacturing implementation.
- Security clearance is an asset.
- Customer-focused with strong communication skills, and the ability to work within a multidisciplinary product development team in a fast-paced and challenging environment.