Thin Films Engineer

Job Title: Thin Films Engineer at Teledyne Digital Imaging, Inc.

Job Summary: We are seeking a highly skilled Thin Films Engineer to join our team at Teledyne Digital Imaging, Inc. The successful candidate will be responsible for supporting and developing deposition processes for thin films on 200mm equipment.

Key Responsibilities:

• Support and develop deposition processes by cathodic sputtering (Al, AlSiCu, AlCu, Ge, Ti, Ru, Mo, V, Vox etc.) on 200mm equipment;
• Support and develop reactive cathodic sputtering deposition processes (TiN, AlN, etc.).

Additional Responsibilities:

• Monitor equipment, manufacturing recipes, and processes to ensure continuous improvement;
• Interact daily with equipment technicians and provide support to production line staff when needed;
• Contribute to improving equipment performance indicators and process steps, such as cycle time, yield, statistical process control, and cost reductions;
• Write documentation to support production and development tasks;
• Resolve equipment and manufacturing process-related issues.

Requirements and Skills:

Education: A university degree (B.Eng, B.Sc., M.Eng, M.Sc., or Ph.D.) in physical engineering, physics, electrical engineering, mechanical engineering, chemical engineering, or a related field.

Knowledge and Experience:

• Knowledge of Silicon wafer microfabrication (an asset): MEMS processes; wafer-level packaging processes (WLP); CCD and CMOS processes;
• Knowledge of printed circuit board manufacturing technologies (an asset).

Language and Communication: Functionally bilingual in French and English, with good learning ability and multitasking skills.

Company Culture: Teledyne Digital Imaging, Inc. is a global leader in the field of sensing solutions. Our company culture values honesty, integrity, and ethics, and we adhere to the highest ethical standards in our business practices.