ASIC Physical Design Engineering Intern
13 hours ago
Markham, ON, Canada
QUALCOMM, Inc.
Full-time
€77,000 - €146,000 Contract
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ASIC physical design and scripting define this Qualcomm internship in Markham, Canada, supporting synthesis analysis and backend flow work.
As an Intern on Qualcomm’s QDSP team, you will contribute to ASIC physical design implementation tasks. You will work with current ASIC technologies, EDA tools, and flow methodology development. TCL, Perl, and Python scripting support these engineering activities.
Key Responsibilities
- Analyze synthesis and backend flows for ASIC implementation
- Support physical design implementation related tasks
- Develop flow methodologies using scripting languages
- Work with current ASIC technologies and EDA tools
- Contribute to Qualcomm QDSP team engineering activities
Requirements:
- Study toward a bachelor’s or master’s degree
- Electrical Engineering, Computer Engineering, or related field
- Experience with TCL, Perl, and Python
- VLSI academic or project experience is desirable
- At least one year programming experience academically Build ASIC physical design experience with Qualcomm through synthesis analysis, backend flows, EDA tools, and scripting.
Key Responsibilities
- Analyze synthesis and backend flows for ASIC implementation
- Support physical design implementation related tasks
- Develop flow methodologies using scripting languages
- Work with current ASIC technologies and EDA tools
- Contribute to Qualcomm QDSP team engineering activities
Requirements:
- Study toward a bachelor’s or master’s degree
- Electrical Engineering, Computer Engineering, or related field
- Experience with TCL, Perl, and Python
- VLSI academic or project experience is desirable
- At least one year programming experience academically Build ASIC physical design experience with Qualcomm through synthesis analysis, backend flows, EDA tools, and scripting.