Technical Fellow

3 weeks ago


Ottawa, Canada Tech Insights Full time

A leading semiconductor firm in Ottawa seeks a Technical Fellow to drive innovation in Advanced Packaging and HPC. The candidate will lead as a subject matter expert, shape technology roadmaps, and accelerate analysis through AI. Requires 10+ years in semiconductor packaging and a Master’s/PhD in a relevant field. The position fosters an inclusive environment and requires global travel (up to 30%). Competitive salary range is CAD 175,000 - 195,000.
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  • Technical Fellow

    3 weeks ago


    Ottawa, Canada Tech Insights Full time

    A leader in semiconductor intelligence in Ottawa is seeking a Technical Fellow for Advanced Packaging and High Performance Computing (HPC) to bridge semiconductor process and architecture. The ideal candidate will have over 10 years of experience, a Master’s or PhD, and a proven track record in advanced packaging and interconnect innovation. This role...

  • Technical Fellow

    3 weeks ago


    Ottawa, Canada Tech Insights Full time

    A leader in semiconductor intelligence in Ottawa is seeking a Technical Fellow for Advanced Packaging and High Performance Computing (HPC) to bridge semiconductor process and architecture. The ideal candidate will have over 10 years of experience, a Master’s or PhD, and a proven track record in advanced packaging and interconnect innovation. This role...

  • Technical Fellow

    4 weeks ago


    Ottawa, Canada Tech Insights Full time

    A leading semiconductor firm in Ottawa seeks a Technical Fellow to drive innovation in Advanced Packaging and HPC. The candidate will lead as a subject matter expert, shape technology roadmaps, and accelerate analysis through AI. Requires 10+ years in semiconductor packaging and a Master’s/PhD in a relevant field. The position fosters an inclusive...

  • Technical Fellow

    4 weeks ago


    Ottawa, Canada Tech Insights Full time

    A leading semiconductor firm in Ottawa seeks a Technical Fellow to drive innovation in Advanced Packaging and HPC. The candidate will lead as a subject matter expert, shape technology roadmaps, and accelerate analysis through AI. Requires 10+ years in semiconductor packaging and a Master’s/PhD in a relevant field. The position fosters an inclusive...


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