Thermal Micro-sensors

**Institut Interdisciplinaire d’Innovation Technologique (3IT) **_usherbrooke.ca/3it_
**Centre de Collaboration MiQro Innovation (C2MI) **_c2mi.ca_

**Context**: Continuing progress in electronics today relies to a great extent on the ability of industrials to tightly integrate together different types of devices and integrated circuits, a practice known as heterogeneous packaging integration. Such trend increases the power density within the module at a point where thermal management with innovative solutions are critical. The main objective of the research project, realized in collaboration with the **C2MI **and **IBM**, is to use advanced microfabrication technologies to proposed advanced packaging solutions with embedded sensors for a better understanding of package temperature distribution to identify and evaluate the most valuable thermal paths. **To achieve this goal, we will first focus on the development of instrumented modules comprising lid with embedded thermal sensors that minimize the impact on the thermal path. These instrumented lids will be used to evaluate different thermal approaches within commercial modules to assess thermal interface materials and assembly performance.** performance.

**Research project**:This 2-year Postdoc is to develop and improve packaging technologies with regards to their overall package thermal performance (lower thermal resistivity, lower manufacturing variability) for more efficient heat dissipation and manufacturability processes. In order to reach this objective, it is critical to gain more precise knowledge on the various scientific relationships between the TIM material properties, their thermal and mechanical behaviour in real packaging environment using dedicated test vehicles. **The overall objective of the project is to investigate new techniques to assess the thermal integrity of microelectronic modules by developing and integrating embedded temperature sensors on lid and organic substrate.**

**Supervision & work environment**:The work will be carried out under the co-supervision of Prof. Dominique Drouin and Prof. Yann Beilliard as part of the IBM/NSERC Industrial Research Chair in High Performance Microelectronic Heterogeneous Integration. The work will be done mainly at the Interdisciplinary Institute for Technological Innovation (3IT) at the Université de Sherbrooke and at the MiQro Innovation Collaborative Center (C2MI) in Bromont. 3IT is a unique institute in Canada, specializing in the research and development of innovative technologies for energy, electronics, robotics and health. C2MI is an international center for collaboration and innovation in the MEMS and encapsulation sector. It is the essential link between applied research and the marketing of microelectronics products. The student will thus benefit from an exceptional research environment that combines students, professionals, professors and industrialists working hand-in-hand to develop the technologies of the future.

**Researched profile**:

- Specialization in nanotechnology, thermal sensors and materials science
- Strong adaptability, autonomy and teamwork
- Strong taste for design, experimental cleanroom work, research and development
- Strengths: skills in packaging of electronic chips and thermal management

**Contacts**:jobnano usherbrooke. ca

**Documents to provide**:

- CV,
- Cover letter
- Letters of recommendation and/or contact details of 2 references.

Schedule:

- Monday to Friday

**Education**:

- Doctoral Degree (required)