Hardware Engineering M

Nuvacore is building a ground-up high performance, low-power CPU for next-generation compute workloads. We are seeking a highly skilled and motivated Hardware Board Design Engineer to drive the architecture, design, and development of next-generation, high-performance, and energy-efficient CPU server solutions for data center applications. You will collaborate closely with cross-functional teams—including Package Design, Signal/Power Integrity (SI/PI), Thermal/Mechanical Engineering, and Software/Firmware—to deliver robust, scalable, and cutting-edge system platform hardware. Board-Level Architecture & Design: Lead the design and development of complex, multi-layer, high-density interconnect (HDI) server motherboards, baseboards, and riser cards optimized for data center workloads Ownership of schematic entry, creation of complex hierarchical designs, and rigorous component selection prioritizing power efficiency, thermal performance, and long-term reliability PCIe Gen6/Gen7, DDR5/LPDDR6, CXL) and robust power delivery networks (PDN) Power & Thermal Management: Design highly efficient, high-current power delivery paths (VRMs, multiphase buck converters) capable of supporting ultra-high-power CPUs while meeting strict data center energy-efficiency metrics Manufacturing Support: Generate comprehensive fabrication and assembly documentation (Gerbers, BOMs, ODB++). Partner with fabrication houses and EMS partners to resolve DFM/DFA/DFT issues and ensure smooth mass production transitions Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field

Experience:
5+ years of professional experience in high-speed hardware board design, ideally focused on enterprise servers, data center hardware, or complex computing platforms Power Delivery: Proven experience with board-level power distribution design, DC-DC converters, and multi-phase VRMs supporting high-current rails Lab

Skills:
Strong hands-on laboratory experience with hardware debugging, rework, and using diagnostic equipment (DMMs, scopes, network analyzers) Master’s degree in Electrical Engineering or Computer Engineering Advanced Data Center

Experience:
10+ years deep understanding of data center server architectures, OCP (Open Compute Project) standards, and system topologies (e.g., CPU sockets, high-speed riser configurations, and BMC sub-systems) Silicon-Package-Board Co-Design: Familiarity with the interplay between advanced semiconductor packaging (e.g., chiplets, 2.5D bridges) and high-density PCB implementation Simulation & Modeling: Familiarity with SI/PI and thermal simulation concepts using tools such as Ansys (SIwave, HFSS), Cadence Sigrity, or HyperLynx to guide early-stage design constraints Manufacturing Integration: Strong background in optimizing layouts for high-volume manufacturing, minimizing layer counts while maintaining performance, and handling DFX (Design for Manufacturing/Assembly/Test) validation We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. If you would like more information about how your data is processed, please contact us. #