Thermal Design Engineer

Family Description Applied R&D (AR) consists of target-oriented research either with the goal of solving a particular problem / answering a specific question or for multi-discipline design, development, and implementation of hardware, software, and systems including maintenance support. Supplies techno-economic consulting to clients. AR work is characterised by its detailed and complex nature in order to systematically combine existing knowledge and practices to further developing and incrementally improving products, operational processes, and customer-specific feature development. Subfamily Description Eletromechanical Design (EDE) consists of mechanics, thermal, interconnections, Power Supply Unit (PSU), Printed Wiring Board (PWB) layout design, and HW usability. EDE requires innovative design knowhow to design electromechanics parts to Base Transceiver Station (BTS) module, units, etc. Design targets are high quality, easy installability, and reliability products with low costs. Qualifications Impact Short-term and usually departmental/project in scope. Accountable for quality, accuracy and efficiency of own and/or team achievements. Actions and errors can have program, project, functional impact. Scope & Contribution Individual Contributor: Performs and/or coordinates day-to-day activities to meet departmental/project objectives. Carries out root/cause analysis in more complex problems. Can develop and implement recommendations. Managerial/Supervisory: Direct supervisory responsibilities for people. Typically first level (and lowest level) of solid line management. Carries out variety of complex activities according to plan within broader area of responsibility, analyses problems. Decision-making typically according to established solutions. Innovation Accepts responsibility for and demonstrates support for delegated decisions. Requires minimum supervision. Uses non standard approaches to resolving issues. Suggests improvements and seeks opportunities for innovation. Demonstrates initiative & adaptability to changing business environments. Is willing to take on new roles or jobs appropriate to skill set in different environments and/or locations. Communication Works to influence others to accept job function’s view/practices and agree/accept new concepts, practices, and approaches. Requires ability to communicate with functional leadership regarding team & technical matters. May conduct briefings with senior leaders within the job function. May at times be required to negotiate regarding operational issues. Has cross-cultural knowledge and global mindset. Knowledge & Experience Mechanical or Thermal Engineering degree or equivalent. 5+ years of experience in electronics cooling, preferably in the telecommunications industry with a good understanding of telecommunication network architecture and design. Experience using CFD thermal analysis tools (Flomerics tools from Siemens) and other heat transfer related analysis tools. Additional experience in electronics packaging would be an asset. Good communication skills, both verbal and written. Can work efficiently both independently and as part of a team. Self-motivated enthusiastic team player with good written/verbal communication. Excellent analytical skills and ability to build relationships across multiple teams. Responsibilities Participate in the design and development of complex mechanical designs (product architecture, detailed specification definition for complex systems, technology (component) selection and the application of design tools/methods). Work on device package, PCB assembly, and system level products/solutions. Collaborate with multi-disciplinary design teams and contribute at all stages of the product lifecycle from architecture through design, test, and final release, to find optimal thermal solutions for our products. Conduct CFD simulations using industry leading tools. Perform empirical testing to validate and support simulations. Investigate industry trends and interface with thermal component suppliers to learn and assess new technologies. Provide sizing and estimates of work and review of product development schedules. #J-18808-Ljbffr