Microelectronics Process Engineer at AMT
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Key Responsibilities
• Define assembly strategies for complex optoelectronic modules
• Lead development of process recipes, including flip-chip and wire bonding
• Research, procure, and oversee capital equipment testing
• Provide DFx guidance to optimize yield and reliability
• Serve as technical liaison during development, translating requirements
Requirements:
• Master's Degree in Engineering fields
• Minimum 8 years of microelectronics packaging experience
• Expertise in flip-chip and wire bonding processes
• Strong material science knowledge
• Proficient in automated assembly equipment programming Shape the future of connectivity and make your mark with AMT in Kanata, ON.
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