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Senior Microelectronic Design Engineer
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Ottawa, Canada Global Talent Alliance, Canada Full timeAbout the job Senior Microelectronic Design Engineer Job#81393 Job Purpose The Microelectronic Design Engineering team, as part of our company'sGlobal Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and...
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Ottawa, Canada Sanmina Full timeA leading electronics manufacturing company in Ottawa is seeking a Microelectronic Packaging Design Engineer to design and develop microelectronic packages. The ideal candidate will have extensive experience in electronic design and packaging, including proficiency with Cadence Allegro. This full-time role requires strong communication skills and the ability...
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Senior Microelectronic Design Engineer
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Ottawa, Canada Global Talent Alliance, Canada Full timeA leading technology firm in Canada is seeking a Senior Microelectronic Design Engineer to lead product development in microelectronics. The role involves collaborating with a multidisciplinary team, managing product documentation, and ensuring product compliance. Ideal candidates will have a Bachelor's Degree in Mechanical Engineering or Physics and a...
Senior Microelectronic Design Engineer
29 minutes ago
About the job Senior Microelectronic Design Engineer Job#81393 Job Purpose The Microelectronic Design Engineering team, as part of our company'sGlobal Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering. We are seeking a Senior Microelectronic Design Engineer to join our team to support and lead both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases. Nature of Duties/Responsibilities: Product development lead in microelectronic design and engineering as part of a multidisciplinary product development team, including electrical/RF engineering, optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, in line with customer requirements and specifications. Industry assessment and selection microelectronic technologies and definition of design concepts, based on product applications, requirements and specifications. Engineering and design of microelectronic packages & modules, including integrating elements of material selections, substrate layout and designs, mechanical, thermal as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing. Management of product documentation process including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO). Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components. Oversee and support engineering product verification, ensuring compliance to product requirements. Drive business development initiatives including interfacing with potential and existing customers, preparation of marketing materials, proposals and quotations. Product management and lead of turnkey the product development process through to manufacturing implementation. Education and Experience: Bachelors Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications. Minimum of 8 years of relevant industry experience. Proficient in computer aided design software and tools (AutoCad®, SolidWorks®). Experience with commercial FEA tools and supporting analysis. Experience with packaging and substrate design software (Cadence® Allegro® Package Designer Plus). Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods. Experience in end-to-end product development and manufacturing implementation. Security clearance is an asset. Customer focused with strong communication skills, and has the ability to work within a multidisciplinary product development team in a fast-paced and challenging environment. #J-18808-Ljbffr
