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Advanced Packaging Engineer
2 months ago
Social networking, machine learning, and big data analytics demand ever-increasing network connectivity. RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures. We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation. Working with world-class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data centers.
We are seeking an Advanced Packaging Engineer to join our team.
As a successful candidate, you will be working as the Photonic/ASIC Components integrator, collaborating with Photonics, High-Speed ASIC, and Laser design teams, as well as Ranovus’ CMs, to define best-in-class optimal assembly processes for high-volume Optical Engine (Module) manufacturing targeted for data center applications. In conjunction with the project team, your role will be to support the micro-assembly process development (and manufacturing work instructions) during all phases of the project development (i.e. During NPI & Production Phase). Specifically, you will work on improvement and optimization of Silicon integrated photonic devices manufacturing & assembly processes.
Responsibilities generally include:
- Design and develop complex sub-assemblies, components, and packaging as assigned.
- Develop and implement changes to product design and/or the manufacturing process to achieve efficiency, quality, and/or cost improvements by participating in new product development programs.
- Develop requirement specifications, system concepts, CAD generated using SolidWorks, detail drawings, BOMs, and budgets. Make layouts of complex assemblies and details of parts of devices, mechanisms, and structures.
- Provide customer product design engineering for economic production; may participate in meetings with customers.
- Assess proper material, tooling, automation, and equipment selection.
- Work with manufacturing to troubleshoot problems, upgrades, retrofits, set-ups, methods development, and the development of process parameters.
- Participate in product development meetings and may make recommendations to product design changes to enhance manufacturing and assembly.
- Conduct proof of concept experiments and design other testing requirements as needed.
- Develop SOPs, operations, and maintenance manuals.
- Research new technology or development tools to remain informed of current technology.
- Understand Lean Six Sigma tools, projects, and processes and incorporate these into assigned engineering projects.
- Review completed projects for accuracy, clarity, and completeness.
- Ensure projects are compliant with all local, regional, and national regulatory requirements, codes, and controls.
- Support all company safety and quality programs and initiatives.
- May perform other duties and responsibilities as assigned.
Required skills and experience include:
- Experience with Photonic, Laser, and ASIC components and micro-assembly.
- Experience in flip chip, chip on chip die attachment (on wafer), and fiber attachment processes.
- 5-10 years of solid experience in related work.
- Excellent ability to solve technical, scientific, and experimental problems.
- Excellent teamwork and communication skills.
Required education:
- Master’s or PhD preferred in a related engineering discipline.
Ranovus is an equal opportunity employer and employs personnel without regard to age, ancestry, colour, race, citizenship, ethnic origin, place of origin, creed, disability, family status, marital status (including single status), gender identity, gender expression, record of offences, sex, or sexual orientation. While remaining alert and sensitive to the issues of fair and equitable treatment for all, Ranovus has a special concern with the participation and advancement of members of four designated groups that have traditionally been disadvantaged in employment: women, visible minorities, Indigenous peoples, and persons with disabilities.
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