L.A.B Process Engineer – Semiconductor Advanced Chip Packaging
3 weeks ago
Laser-Assisted Bonder (LAB) Process Engineer Location: Admiralty Working Days: 5 days a week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends on experience) Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip‑to‑Wafer or Chip‑to‑Substrate bonding. Key Responsibilities Process Development & Optimization: Develop, implement, and optimize laser‑assisted bonding processes for product packaging, advanced interconnects, or micro‑assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput. Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high‑volume production, working with both development and production teams. Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products. Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams. Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost using data‑driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA). Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer. Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation. Safety & Compliance: Ensure adherence to laser safety regulations and best practices in a laboratory or production environment. Customer & Project Support: Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed. Laser Maintenance & Calibration (Good-to-have): Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root‑cause analysis for equipment issues. Requirements Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field. Minimum 2–5 years of hands‑on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes. Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary. Familiarity with bonding equipment and analytical tools (X‑ray, SAM, OM, etc.). Familiarity with advanced process control and manufacturing best practices. Excellent troubleshooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab). Knowledge of bonding process and materials behavior under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure). Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus. Interested applicants, WA your resume to or email your resume to #J-18808-Ljbffr
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, AB, Canada The Supreme HR Advisory Full timeOverview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding. Key Responsibilities Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding...
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Semiconductor Packaging Module Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timeSemiconductor Packaging Module Design Engineer (TCB / Die Handling) Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
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LAB Process Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition title : Laser-Assisted Bonder (LAB) process engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced...
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, AB, Canada The Supreme HR Advisory Full timeA premier HR advisory firm in Canada, Alberta is searching for a Laser-Assisted Bonder (LAB) Process Engineer. You will develop and optimize laser bonding processes for chip packaging, ensuring high precision and reliability. The ideal candidate should possess a relevant degree and has 2-5 years of experience in semiconductor packaging processes. This...
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TCB Design Engineer
3 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition Title TCB (Thermo Compression Bonding) Design Engineer Location Admiralty Street Working Days 5 Day A Week Working Hours 9:00am - 6:00pm Salary $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
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TCB Design Engineer
4 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition title: TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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TCB Semiconductor Packaging Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timeTCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced...
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TCB Semiconductor Packaging Design Engineer
2 weeks ago
, AB, Canada The Supreme HR Advisory Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
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, AB, Canada The Supreme HR Advisory Full timeA leading HR consultancy in Canada seeks a LAB Process Engineer to develop and optimize laser bonding processes for advanced packaging applications. The ideal candidate must have a Bachelor’s or Master’s in a relevant field, along with 2–5 years of experience in semiconductor packaging. Strong knowledge of bonding technologies and troubleshooting...
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, AB, Canada The Supreme HR Advisory Full timePosition: Laser‑Assisted Bonder (LAB) Process Engineer Location: Admiralty Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience) Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes – especially in high‑precision, high‑reliability Advanced...
